CAPABILITIES

Sensera offers the following micro-fabrication process capabilities to its clients. Manufacturing is generally done on silicon or glass substrates.  Manufacturing and development is conducted in accordance with an ISO 9001:2015 compliant quality system.

PROCESSING PACKAGING METROLOGY
Anisotropic Silicon Etch Automated Wafer Dicing Automated Electrical Wafer Probe
High Selectivity Deep Reactive Ion Etch Epoxy and Solder Die Attachment Film Stress Measurement
Metal Wet Etch Anodic and glass frit wafer bonding Surface Profilometry
Dielectric Wet Etch   Critical Dimension Analysis
Oxide Inductively Coupled Plasma Etch    
Ion Beam Etch    
Front & Backside Contact Aligner    
Photolithographic Stepper    
e-Beam Lithography    
Metal Sputter Deposition    
Evaporation Deposition    
Atomic Layer Deposition    
Plasma Enhanced Chemical Vapor Deposition    
Superhydrophobic and Oleophobic Coating    
Sensera’s Quality System integrates Process Control Planning, Gauge Capability, Statistical Process Control and Process Failure Mode Effects Analysis (pFMEA) for both development and manufacturing

 

 

Sensera Inc Corporate Headquarters: 200 Turnpike Road, Chelmsford, MA 01824 / Tel: 978-606-2600 / Fax: 978-250-4533
Microfabrication Facility: 15 Presidential Way, Woburn, MA 01801
www.sensera.com / email: info@sensera.com An ISO9001:2015 Certified Company.

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